Bonding device and method in microcomponent process and welding-agent placing unit

A bonding method in a microcomponent process, comprising:

• peeling a microcomponent to-be-bonded from a substrate;
• picking up, through a transfer unit, and transferring, through the transfer unit, the microcomponent to-be-bonded to a welding-agent placing unit so that an electrode of a microcomponent to-be-bonded adheres to a molten welding agent in the welding-agent hole from the welding-agent placing unit, wherein the microcomponent to-be-bonded has an electrode configured to adhere to a molten welding agent in the welding-agent hole of the welding-agent placing unit;
• and
• transferring the microcomponent to-be-bonded with the molten welding agent to a driving backplate to bond the microcomponent to-be-bonded with the driving backplate after the molten welding agent cools.