B23K 3/0646
Solder baths
Official title: {Solder baths}
B23K3/0646 (Solder baths) appears on 464 US grants and 257 published applications in this corpus.
Search patents in B23K- Granted patents
- 464
- Published applications
- 257
- Assignees
- 238
- Inventors
- 745
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 7 | 0 |
| 1978 | 11 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 7 | 0 |
| 1983 | 8 | 0 |
| 1984 | 7 | 0 |
| 1985 | 15 | 0 |
| 1986 | 15 | 0 |
| 1987 | 19 | 0 |
| 1988 | 12 | 0 |
| 1989 | 16 | 0 |
| 1990 | 10 | 0 |
| 1991 | 10 | 0 |
| 1992 | 7 | 0 |
| 1993 | 12 | 0 |
| 1994 | 10 | 0 |
| 1995 | 10 | 0 |
| 1996 | 13 | 0 |
| 1997 | 11 | 0 |
| 1998 | 12 | 0 |
| 1999 | 13 | 0 |
| 2000 | 14 | 0 |
| 2001 | 11 | 4 |
| 2002 | 13 | 18 |
| 2003 | 12 | 13 |
| 2004 | 15 | 9 |
| 2005 | 9 | 9 |
| 2006 | 3 | 10 |
| 2007 | 4 | 8 |
| 2008 | 2 | 7 |
| 2009 | 2 | 11 |
| 2010 | 5 | 11 |
| 2011 | 6 | 10 |
| 2012 | 10 | 13 |
| 2013 | 7 | 6 |
| 2014 | 5 | 10 |
| 2015 | 12 | 15 |
| 2016 | 8 | 12 |
| 2017 | 8 | 8 |
| 2018 | 13 | 11 |
| 2019 | 7 | 11 |
| 2020 | 4 | 16 |
| 2021 | 12 | 10 |
| 2022 | 10 | 11 |
| 2023 | 8 | 5 |
| 2024 | 2 | 3 |
| 2025 | 8 | 12 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Radiant curtain heating assembly for wave soldering machine7 Jul 2026US 12,673,377 B2Illinois Tool Works Inc.
- System and method for combined wave solder flow design16 Jun 2026US 12,654,248 B2Illinois Tool Works Inc.
- Soldering system and method of use31 Mar 2026US 12,589,445 B2Illinois Tool Works Inc.
- Dual pump system and method to control wavesolder contact length3 Feb 2026US 12,543,271 B1Illinois Tool Works Inc.
- Wave solder finger detection system and method20 Jan 2026US 12,532,444 B1Illinois Tool Works Inc.
- Preheating mechanism of jet soldering apparatus, and jet soldering apparatus16 Jul 2026US 2026/0199996 A1Koki Tec Corp.
- Dual pump system and method to control wavesolder contact length18 Jun 2026US 2026/0173278 A1Illinois Tool Works Inc.
- Wave height control for wave soldering1 Jan 2026US 2026/0001154 A1Schweitzer Engineering Laboratories, Inc.
- Solder Supply Method1 Jan 2026US 2026/0001173 A1Senju Metal Industry Co., Ltd.
- Jet soldering apparatus11 Dec 2025US 2025/0375827 A1Senju Metal Industry Co., Ltd.
Most cited
By later US patents
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Apparatus for dispensing material in a printer120US 5,947,022 ASpeedline Technologies, Inc. · 1999
- Method and apparatus for dispensing material in a printer72US 6,324,973 B2Speedline Technologies, Inc. · 2001
- Solder pot64US 4,562,337 AEldon Industries, Inc. · 1985
- Method and apparatus for dispensing material in a printer55US 6,619,198 B2Speedline Technologies, Inc. · 2003