B23K 3/0661
Oscillating baths
Official title: {Oscillating baths}
B23K3/0661 (Oscillating baths) appears on 24 US grants and 4 published applications in this corpus.
Search patents in B23K- Granted patents
- 24
- Published applications
- 4
- Assignees
- 16
- Inventors
- 36
- Latest grant
- 29 Nov 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Ball jumping apparatus and ball absorption29 Nov 2022US 11,511,363 B2Samsung Electronics Co., Ltd.
- Solder joint structure and solder joining method31 May 2016US 9,352,408 B2Nidec Corporation
- Solder bump forming apparatus and soldering facility including the same18 Feb 2014US 8,651,356 B2Samsung Electro-Mechanics Co., Ltd.
- Soldering alloy9 Dec 2003US 6,659,329 B1Edison Welding Institute, Inc.
- Gas shrouded solder wave with reduced solder splatter14 Mar 1995US 5,397,049 AElectrovert Ltd.
- Ball jumping apparatus and ball absorption method using the same27 Jan 2022US 2022/0023963 A1Samsung Electronics Co., Ltd.
- Secondary battery10 Mar 2016US 2016/0072115 A1Samsung SDI.Co., Ltd.
- Solder joint structure and solder joining method8 May 2014US 2014/0126956 A1Nidec Corporation
- Solder bump forming apparatus and soldering facility including the same30 May 2013US 2013/0134208 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Gas shrouded wave soldering with gas knife44US 5,240,169 AElectrovert Ltd. · 1993
- Gas shrouded wave soldering42US 5,203,489 AElectrovert Ltd. · 1993
- Shield gas wave soldering35US 5,121,874 AElectrovert Ltd. · 1992
- Shield gas wave soldering34US 5,044,542 AElectrovert Ltd. · 1991
- Vibratory wave soldering22US 4,684,056 AElectrovert Ltd. · 1987