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US 8,651,356 B2Granted
Solder bump forming apparatus and soldering facility including the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsNoriaki Mukai, Hueng Jae Oh, Dae Young Lee, Jin Won Choi
Life of this patent
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Abstract
Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
Claims15
A solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus comprising:
- a solder bath receiving a solder therein;
- an agitator agitating the solder in the solder bath, the agitator including
- an agitating roller rotatably installed in the solder bath,
- a heater fixedly installed in the agitating roller to thereby heat the solder, and
- a temperature controller controlling a heating temperature of the heater;
- a driver driving the agitator;
- and
- a suction pressure provider providing suction pressure to the substrate.
5 more elements
A soldering facility comprising:
- a substrate transferring apparatus transferring a processing substrate;
- and
- a solder bump forming apparatus performing a soldering process on the processing substrate transferred by the substrate transferring apparatus, the solder bump forming apparatus including:
- a solder bath receiving a solder therein,
- an agitator agitating the solder in the solder bath, the agitator including:
- an agitating roller rotatably installed in the solder bath,
- a heater fixedly installed in the agitating roller to thereby heat the solder, and
- a temperature controller controlling a heating temperature of the heater;
- a driver driving the agitator, and
- a suction pressure provider providing suction pressure to the processing substrate transferred on the solder bath by the substrate transferring apparatus.
7 more elements
Dependencies are inferred from the claim text.