Gas shrouded solder wave with reduced solder splatter

An apparatus for wave soldering an element comprising:

• a solder reservoir adapted to contain molten solder and having at least one solder wave nozzle projecting therefrom;
• pump means for forming a solder wave from the nozzle;
• cover means for covering at least a portion of the reservoir containing the solder wave, the cover means having at least one longitudinal slot for the solder wave to pass therethrough and to contain solder splatter caused by the solder wave falling into the solder reservoir, the cover means having skirts to extend into the solder reservoir on both sides of the solder wave;
• supply means for supplying gas to pass through openings in the skirts on both sides of the solder wave, the gas permitted to pass upwards through the longitudinal slot on both sides of the solder wave and provide a gas blanket over the solder wave, and
• conveyor means for moving the element in a predetermined path over the cover means ensuring at least a portion of the element passes through the solder wave.

An apparatus for wave soldering an element comprising:

• a solder reservoir adapted to contain molten solder at a solder level and having at least one solder wave nozzle projecting therefrom;
• pump means for forming a solder wave from the nozzle;
• cover means for covering at least a portion of the reservoir containing the solder wave, the cover means extending adjacent at least one side of the solder wave to contain solder splatter from the solder wave falling into the solder reservoir;
• supply means for supplying gas on both sides of the solder wave nozzle above the solder level, the gas to pass upwards between the cover means and the solder wave and provide a gas blanket over the solder wave, and
• conveyor means for moving an element in a predetermined path over the cover means ensuring at least a portion of the element passes through the solder wave.