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US 2013/0134208 A1Published application
Solder bump forming apparatus and soldering facility including the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsNoriaki MUKAI, Hueng Jae OH, Dae Young LEE, Jin Won CHOI
Life of this patent
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Abstract
Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
Claims21
A solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus comprising:
- a solder bath receiving a solder therein;
- an agitator agitating the solder in the solder bath;
- a driver driving the agitator;
- and
- a suction pressure provider providing suction pressure to the substrate.
2 more elements
A soldering facility comprising:
- a substrate transferring apparatus transferring a processing substrate;
- and
- a solder bump forming apparatus performing a soldering process on the processing substrate transferred by the substrate transferring apparatus,
- wherein the solder bump forming apparatus includes:
- a solder bath receiving a solder therein;
- an agitator agitating the solder in the solder bath;
- a driver driving the agitator;
- and
- a suction pressure provider providing suction pressure to the processing substrate transferred on the solder bath by the substrate transferring apparatus.
6 more elements
Dependencies are inferred from the claim text.