B23K 3/0692
With intermediary means for bringing solder on workpiece
Official title: {with intermediary means for bringing solder on workpiece, e.g. rollers}
B23K3/0692 (With intermediary means for bringing solder on workpiece) appears on 34 US grants and 12 published applications in this corpus.
Search patents in B23K- Granted patents
- 34
- Published applications
- 12
- Assignees
- 18
- Inventors
- 47
- Latest grant
- 29 Nov 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 2 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 2 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 1 |
| 2022 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Device and method for reel-to-reel laser reflow29 Nov 2022US 11,515,287 B2Laserssel Co., Ltd.
- Device and method for reel-to-reel laser reflow22 Feb 2022US 11,257,783 B2Laserssel Co., Ltd.
- Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same20 Oct 2015US 9,162,249 B2Panasonic Intellectual Property Management Co., Ltd.
- Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method6 Oct 2015US 9,149,883 B2Tanigurogumi Corporation
- Solder ball loading mask, apparatus and associated methodology28 May 2013US 8,448,838 B2Ibiden Co., Ltd.
- Device and method for reel-to-reel laser reflow19 May 2022US 2022/0157769 A1Laserssel Co., Ltd.
- Flux transfer apparatus17 Jun 2021US 2021/0185828 A1Kabushiki Kaisha Shinkawa
- Device and method for reel-to-reel laser reflow8 Oct 2020US 2020/0321310 A1Crucialmachines Co.,Ltd.
- Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method17 Oct 2013US 2013/0269984 A1Tanigurogumi Corporation
- Solder Ball Loading Mask, Apparatus And Associated Methodology5 Apr 2012US 2012/0080504 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Apparatus for dispensing material in a printer120US 5,947,022 ASpeedline Technologies, Inc. · 1999
- Method and apparatus for dispensing material in a printer72US 6,324,973 B2Speedline Technologies, Inc. · 2001
- Method and apparatus for dispensing material in a printer55US 6,619,198 B2Speedline Technologies, Inc. · 2003
- Apparatus for dispensing material in a printer55US 6,626,097 B2Speedline Technologies, Inc. · 2003