B23K 3/0676
Conveyors therefor
Official title: {Conveyors therefor}
B23K3/0676 (Conveyors therefor) appears on 71 US grants and 12 published applications in this corpus.
Search patents in B23K- Granted patents
- 71
- Published applications
- 12
- Assignees
- 48
- Inventors
- 91
- Latest grant
- 20 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 2 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 2 |
| 2017 | 2 | 3 |
| 2018 | 3 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wave solder finger detection system and method20 Jan 2026US 12,532,444 B1Illinois Tool Works Inc.
- Soldering module2 Oct 2018US 10,086,460 B2Illinois Tool Works Inc.
- Soldering device11 Sep 2018US 10,076,041 B2Senju Metal Industry Co., Ltd.
- Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor1 May 2018US 9,956,634 B2Senju Metal Industry Co., Ltd.
- Jet nozzle and jet soldering apparatus26 Dec 2017US 9,849,535 B2Senju Metal Industry Co., Ltd.
- Soldering Device26 Oct 2017US 2017/0311453 A1Senju Metal Industry Co., Ltd.
- Soldering module27 Jul 2017US 2017/0209949 A1Illinois Tool Works Inc.
- Jet Nozzle and Jet Soldering Apparatus16 Mar 2017US 2017/0072492 A1Senju Metal Industry Co., Ltd.
- Wave soldering nozzle system and method of wave soldering25 Feb 2016US 2016/0052074 A1Illinois Tool Works Inc.
- Solder application method and apparatus11 Feb 2016US 2016/0039032 A1GTAT Corporation
Most cited
By later US patents
- Solder ball placement apparatus45US 6,056,190 ASpeedline Technologies, Inc. · 2000
- Apparatus for holding printed circuit boards during wave soldering and processing39US 5,067,648 ALockheed Sanders, Inc. · 1991
- Apparatus for applying solder to printed circuit boards30US 4,408,560 ASinter Limited · 1983
- Adjustable printed circuit board pallet24US 4,030,717 AD.N.S. Precision Machining · 1977
- Printed circuits board soldering apparatus23US 5,038,706 ATeledyne Industries, Inc. · 1991