US 9,956,634 B2Granted

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

AssigneeSenju Metal Industry Co., Ltd.

InventorsIsamu Sato, Koji Watanabe, Kota Kikuchi, Michio Suzuki, Naoto Kameda, Hideki Nakamura

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Abstract

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few μm and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few μm.

A hot-dip plating apparatus for plating a thin molten solder film that manufactures a thin solder film plated member by cooling down a base material after coating the washed base material with the molten solder heated to a predetermined temperature, comprising:

a solder bath for, for in an inactive atmosphere, accommodating the molten solder to coat with the solder by dipping the base material;
a cover section for covering the upper portion of said solder bath and having an inlet port for the base material moving toward said solder bath and an outlet port from said solder bath;
a bearing member united with said cover section at the solder bath side of said cover section and supporting a shaft of a roller so as to turn said base material around, to convey it from the inlet port of said cover section to a side of said solder bath and further convey it to the outlet port from the side of said solder bath;
a longitudinal member provided at the side of said solder bath facing said bearing member with respect to said cover member, said cover section and said bearing member being able to slide with said longitudinal member in a unified manner;
a first conveying section provided at an upstream side of said solder bath for applying a predetermined tension to the base material that is to be conveyed to said solder bath, a part of the plating apparatus nearer to the inlet port being the upstream side and a part of the plating apparatus nearer to the outlet port being the downstream side;
a second conveying section provided at the downstream side of said solder bath for conveying the base material while drawing up the base material from said solder bath at a predetermined speed with the tension applied;
a blower section for blowing hot gas on the base material immediately after being drawn up from said solder bath by said second conveying section, the hot gas having a predetermined flow volume and a temperature set to be equal to or higher than a melting temperature corresponding to the composition of the molten solder;
and
a control section for controlling the temperature and flow volume of the hot gas used to trim the molten solder from the base material so as to control the film thickness coated on the base material.

6 more elements

Facts

Application

14/407,040Filed 10 Jun 2013

Priority

JP 2012-13209411 Jun 2012

Published

US 2015/0174678 A125 Jun 2015

Granted

1 May 2018

Term ends

Not estimatedThe source records don’t support an estimate.

Classification26 codes

B23K 3/0676
With dipping means: conveyors therefor
B23K 1/012
Soldering, e.g. brazing, or unsoldering: soldering with the use of hot gas
B23K 1/08
Soldering, e.g. brazing, or unsoldering: soldering by means of dipping in molten solder
B23K 1/20
Soldering, e.g. brazing, or unsoldering: preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Abstract

Claims5