Multi-axis gripper unit of turntable type probe pin bonding apparatus

A multi-axis gripper unit of a turntable-type probe pin laser bonding apparatus comprising:

• a pickup unit that rotates 360 degrees on the horizontal line and transfers the probe pin placed on the tray after holding it with a pin gripper consisting of a pair of clamps;
• a dipping unit applies solder paste to the probe pin transferred by the pickup unit;
• and
• a laser bonding unit bonds the probe pins to the probe card by irradiating a laser beam onto the solder paste of the probe pins transferred from the dipping unit by the pickup unit, wherein,
• an X-axis and Y-axis linear transport module equipped at the end of the pickup unit to linearly transport the pin gripper in the X-axis or Y-axis direction;
• an Xθ-axis and Yθ-axis rotary transfer module equipped between the X-axis and Y-axis linear transfer module and the pin gripper to rotate the pin gripper in the Xθ-axis or Yθ-axis direction;
• a gripper axis linear transfer module equipped between the Xθ and Yθ axis rotary transfer module and the pin gripper to transport the pin gripper to narrow or widen the gap between the pin grippers so that the pin gripper can hold or release the probe pin.