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US 11,602,800 B2Granted
Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
AssigneeEagle Technology, LLC
InventorsMichael T. De Roy, Phillip K. Nickel, Jay S. Nelson, Andres M. Gonzalez, William A. Marquart
Life of this patent
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Abstract
Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.
Claims9
A method for applying solder to a pin, comprising:
- disposing a given amount of solder on a non-wetable surface of a planar substrate;
- aligning the pin with the solder disposed on the non-wetable surface of the planar substrate;
- inserting the pin in the solder;
- performing a reflow process to cause the solder to transfer from the planar substrate to the pin without soldering the pin to the planar substrate;
- and
- moving the pin, with the solder applied thereto, away from the planar substrate.
3 more elements
Dependencies are inferred from the claim text.