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US 11,731,207 B2Granted
Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
AssigneeEagle Technology, LLC
InventorsMichael T. De Roy, Phillip K. Nickel, Jay S. Nelson, Andres M. Gonzalez, William A. Marquart
Life of this patent
Estimating the term…
Abstract
Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.
Claims30
A method for providing a soldered interface between a circuit board and a pin, comprising:
- applying first solder directly to the pin by
- disposing a given amount of first solder on a non-wettable surface of a planar substrate,
- inserting the pin in the first solder, and
- performing a reflow process to cause the first solder to transfer from the planar substrate to the pin without soldering the pin to the planar substrate;
- using a jet paste dispenser to apply second solder into a plated contact cavity formed in the circuit board;
- using a stencil screen printer to apply third solder (a) over the plated contact cavity which was at least partially filled with the second solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity;
- inserting the pin with the first solder applied thereto in the plated contact cavity such that the pin passes through the third solder and extends at least partially through the second solder;
- and
- performing a reflow process to heat the first, second and third solder so as to create a solder joint between the circuit board and the pin.
6 more elements
A circuit board, comprising:
- a substrate;
- a plated contact cavity formed in the substrate;
- a pad disposed on the substrate so as to at least partially surround the plated contact cavity;
- and
- at least one pin coupled to the substrate via a solder joint formed by reflowing
- a first solder applied directly to the pin prior to when the pin is inserted into the plated contact cavity,
- a second solder applied to the plated contact cavity using a jet paste dispenser;
- and
- a third solder applied using a stencil screen printer (a) over the plated contact cavity which is at least partially filled with the second solder and (b) over at least a portion of the pad.
6 more elements
Dependencies are inferred from the claim text.