B23K 26/50
Working by transmitting the laser beam through or within the workpiece
B23K26/50 (Working by transmitting the laser beam through or within the workpiece) appears on 1,424 US grants and 2,073 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,424
- Published applications
- 2,073
- Assignees
- 552
- Inventors
- 2,754
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 5 |
| 2002 | 6 | 5 |
| 2003 | 7 | 6 |
| 2004 | 9 | 8 |
| 2005 | 3 | 31 |
| 2006 | 10 | 39 |
| 2007 | 10 | 37 |
| 2008 | 12 | 26 |
| 2009 | 25 | 38 |
| 2010 | 32 | 43 |
| 2011 | 22 | 46 |
| 2012 | 36 | 80 |
| 2013 | 45 | 68 |
| 2014 | 64 | 47 |
| 2015 | 68 | 84 |
| 2016 | 47 | 101 |
| 2017 | 66 | 115 |
| 2018 | 79 | 134 |
| 2019 | 105 | 146 |
| 2020 | 120 | 150 |
| 2021 | 95 | 169 |
| 2022 | 102 | 156 |
| 2023 | 86 | 169 |
| 2024 | 113 | 166 |
| 2025 | 136 | 109 |
| 2026 | 98 | 95 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Femtosecond laser surface processing for controlled fill and targeted deposition6 Oct 2026US 12,752,371 B1Honeywell Federal Manufacturing & Technologies, LLC
- Laser beam irradiation apparatus6 Oct 2026US 12,752,372 B2Disco Corporation
- Laser processing apparatus for performing desired processing on a workpiece29 Sep 2026US 12,746,617 B2Disco Corporation
- Optical system, laser spot position determination process, and calibration process for deterministically shaping substrates using laser pulses22 Sep 2026US 12,741,339 B2Arizona Board of Regents on Behalf of the University of Arizona
- Manufacturing method of gallium nitride substrate22 Sep 2026US 12,741,340 B2Disco Corporation
- Single-crystal diamond microchannel without internal modified area, and manufacturing method thereof8 Oct 2026US 2026/0307177 A1Xi' An Jiaotong University
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Systems and methods for laser processing and optical inspection1 Oct 2026US 2026/0295719 A1Orbotech Ltd.
- Laser heating to adjust substrate warpage1 Oct 2026US 2026/0305233 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Method for controlling configuration of laser induced breakdown and ablation454US 5,656,186 AThe Regents of the University of Michigan · 1997
- Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus388US 6,521,511 B1Seiko Epson Corporation · 2003
- Method and apparatus for high precision variable rate material removal and modification344US 6,156,030 AY-Beam Technologies, Inc. · 2000
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus246US 6,878,607 B2Seiko Epson Corporation · 2005