B23K 26/53
For modifying or reforming the material inside the workpiece
Official title: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B23K26/53 (For modifying or reforming the material inside the workpiece) appears on 1,116 US grants and 1,621 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,116
- Published applications
- 1,621
- Assignees
- 375
- Inventors
- 1,946
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 4 |
| 2002 | 6 | 4 |
| 2003 | 3 | 5 |
| 2004 | 8 | 8 |
| 2005 | 2 | 26 |
| 2006 | 10 | 36 |
| 2007 | 10 | 34 |
| 2008 | 10 | 23 |
| 2009 | 24 | 35 |
| 2010 | 32 | 38 |
| 2011 | 19 | 37 |
| 2012 | 32 | 54 |
| 2013 | 35 | 49 |
| 2014 | 53 | 30 |
| 2015 | 50 | 64 |
| 2016 | 33 | 75 |
| 2017 | 44 | 93 |
| 2018 | 62 | 99 |
| 2019 | 80 | 116 |
| 2020 | 96 | 127 |
| 2021 | 77 | 135 |
| 2022 | 78 | 125 |
| 2023 | 72 | 135 |
| 2024 | 87 | 118 |
| 2025 | 102 | 81 |
| 2026 | 71 | 70 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Manufacturing method of gallium nitride substrate22 Sep 2026US 12,741,340 B2Disco Corporation
- Method for producing a detachment region in a solid-state body22 Sep 2026US 12,741,341 B2Siltectra GmbH
- Processing method and processing system22 Sep 2026US 12,745,588 B2Tokyo Electron Limited
- Optical component manufacturing method, and optical component8 Sep 2026US 12,728,481 B2Sumitomo Electric Industries, Ltd.
- Substrate production method and chip production method8 Oct 2026US 2026/0314344 A1Disco Corporation
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Systems and methods for laser processing and optical inspection1 Oct 2026US 2026/0295719 A1Orbotech Ltd.
- Laser heating to adjust substrate warpage1 Oct 2026US 2026/0305233 A1APPLIED Materials.Inc.
- Inspection device and inspection method24 Sep 2026US 2026/0293586 A1Hamamatsu Photonics K.K.
Most cited
By later US patents
- Method for controlling configuration of laser induced breakdown and ablation454US 5,656,186 AThe Regents of the University of Michigan · 1997
- Method and apparatus for high precision variable rate material removal and modification344US 6,156,030 AY-Beam Technologies, Inc. · 2000
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- 3-dimensional micromachining with femtosecond laser pulses166US 5,786,560 APanasonic Technologies, Inc. · 1998
- Method and apparatus for high precision variable rate material, removal and modification163US 6,482,199 B12002