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US 12,752,371 B1Granted
Femtosecond laser surface processing for controlled fill and targeted deposition
AssigneeHoneywell Federal Manufacturing & Technologies, LLC
InventorsSabrina Marie Wells Torres, Connor Daniel Pearson
Life of this patent
Estimating the term…
Abstract
Systems, methods, devices, and structures for providing selective fluid wicking using surface modification provided by a femtosecond laser processing technique. The surface modification may form a plurality of microstructures, which may be configured to encourage wicking, prevent wicking, or alter a fluid wicking rate based on the specific type of microstructures formed.
Claims18
A process of femtosecond laser surface processing, the process comprising:
- providing a substrate comprising a surface;
- selectively applying, using a femtosecond laser technique, a first surface modification to a first portion of the surface, the first surface modification forming a plurality of hydrophobic microstructures on the first portion of the surface,
- wherein the plurality of hydrophobic microstructures are configured to prevent wicking of an underfill material onto the first portion of the surface;
- selectively applying, using the femtosecond laser technique, a second surface modification to a second portion of the surface, the second surface modification forming a plurality of hydrophilic microstructures on the second portion of the surface,
- wherein the plurality of hydrophilic microstructures are configured to cause wicking of the underfill material onto the second portion of the surface,
- wherein the second portion of the surface comprises a connection area operable to receive at least one electronic component for connection to the surface;
- applying the underfill material onto the surface;
- and
- subsequent to applying the first surface modification and the second surface modification, wicking the underfill material onto the second portion of the surface at the connection area using the plurality of hydrophilic microstructures while preventing wicking of the underfill material onto the first portion of the surface using the plurality of hydrophobic microstructures.
6 more elements
A substrate surface provided by a femtosecond laser surface processing process, the substrate surface comprising:
- a solder fluid applied onto the substrate surface;
- a surface modification selectively applied to a portion of the substrate surface using a femtosecond laser technique to form a plurality of hydrophobic microstructures disposed on the substrate surface, the plurality of hydrophobic microstructures operable to prevent wicking of the solder fluid onto the portion of the substrate surface,
- wherein the plurality of hydrophobic microstructures is positioned at least partially around a connection area on the substrate surface to prevent the solder fluid from flowing out of the connection area;
- and
- a second surface modification selectively applied to a second portion of the substrate surface, the second surface modification including a plurality of hydrophilic microstructures configured to cause wicking of the solder fluid.
2 more elements
A process of femtosecond laser surface processing, the process comprising:
- providing a substrate comprising a surface with a connection area defined thereon, the connection area configured to receive at least one electronic component for connection to the surface;
- selectively applying, using a femtosecond laser technique, a surface modification to a portion of the surface at the connection area, the surface modification forming a plurality of hydrophilic microstructures on the portion of the surface at the connection area,
- wherein the plurality of hydrophilic microstructures are configured to cause wicking of a solder fluid onto the portion of the surface at the connection area;
- applying the solder fluid onto the surface at the connection area;
- subsequent to applying the surface modification, wicking the solder fluid onto the portion of the surface at the connection area using the plurality of hydrophilic microstructures;
- and
- selectively applying, using the femtosecond laser technique, a subsequent surface modification to a subsequent portion of the surface, the subsequent surface modification forming a plurality of hydrophobic microstructures on the subsequent portion of the surface.
4 more elements
Dependencies are inferred from the claim text.