Y10T 428/12514
One component cu-based
Official title: One component Cu-based
Y10T428/12514 (One component cu-based) appears on 98 US grants and 68 published applications in this corpus.
Search patents in Y10T- Granted patents
- 98
- Published applications
- 68
- Assignees
- 67
- Inventors
- 194
- Latest grant
- 21 Nov 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 2 |
| 2002 | 3 | 7 |
| 2003 | 8 | 3 |
| 2004 | 5 | 10 |
| 2005 | 5 | 9 |
| 2006 | 7 | 8 |
| 2007 | 4 | 9 |
| 2008 | 1 | 1 |
| 2009 | 4 | 1 |
| 2010 | 6 | 8 |
| 2011 | 5 | 4 |
| 2012 | 2 | 2 |
| 2013 | 6 | 2 |
| 2014 | 3 | 1 |
| 2015 | 2 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Carrier-attached copper foil21 Nov 2017US 9,826,635 B2Axis Patent International
- Carrier-attached copper foil17 Mar 2015US 8,980,414 B2JX Nippon Mining & Metals Corporation
- Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board3 Feb 2015US 8,946,911 B2Samsung Electro-Machanics Co., Ltd.
- Carrier-attached copper foil and method for manufacturing the same19 Aug 2014US 8,808,873 B2Industrial Technology Research Institute
- Substrate structure and method of manufacturing the same24 Jun 2014US 8,759,986 B2Samsung Electro-Mechanics Co., Ltd.
- Carrier-Attached Copper Foil26 Mar 2015US 2015/0086806 A1JX Nippon Mining & Metals Corporation
- Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board27 Mar 2014US 2014/0087205 A1Samsung Electro-Mechanics Co., Ltd.
- Carrier-attached copper foil22 Aug 2013US 2013/0216855 A1JX Nippon Mining & Metals Corporation
- Metalic laminate and manufacturing method of light emitting diode package using the same18 Jul 2013US 2013/0183479 A1Samsung Electro-Mechanics Co., Ltd.
- Substrate structure and method of manufacturing the same5 Jul 2012US 2012/0171432 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Apparatus and process for producing high density thermal spray coatings93US 4,869,936 AAmoco Corporation · 1989
- Multilayer ceramic substrate with circuit patterns67US 4,795,670 ANarumi China Corporation · 1989
- Material which is at least partially made from a constituent having a one-way shape memory effect and process to produce said material64US 4,518,444 ABBC Brown, Boveri & Company, Limited · 1985
- Functionally graded metal substrates and process for making same56US 6,114,048 ABrush Wellman Inc. · 2000
- Adhesiveless flexible laminate and process for making adhesiveless flexible laminate41US 6,171,714 B2Gould Electronics Inc. · 2001