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US 8,946,911 B2Granted
Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board
AssigneeSamsung Electro-Machanics Co., Ltd.
InventorsJung Youn Pang, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim
Life of this patent
Estimating the term…
Abstract
There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
Claims12
An electrode pad, comprising:
- a connection terminal part;
- a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part;
- and
- a second plating layer formed of pure palladium (Pd) and formed on the first plating layer.
1 more element
A printed circuit board, comprising:
- an insulating substrate;
- a connection terminal part formed on the insulating substrate;
- a first plating layer including palladium phosphorus (Pd—P) formed on the insulating substrate and an outer side of the connection terminal part;
- and
- a second plating layer formed of pure palladium (Pd) and formed on the insulating substrate and an outer side of the first plating layer.
2 more elements
An electrode pad, comprising:
- a connection terminal part that includes copper (Cu);
- a first plating layer including palladium phosphorus (Pd—P) and being in contact with a copper surface of the connection terminal part;
- and
- a second plating layer formed of pure palladium (Pd) and formed on the first plating layer.
1 more element
Dependencies are inferred from the claim text.