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US 2014/0087205 A1Published application
Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJung Youn PANG, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim
Life of this patent
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Abstract
There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
Claims15
An electrode pad, comprising:
- a connection terminal part;
- a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part;
- and
- a second plating layer including palladium (Pd) formed on the first plating layer.
1 more element
A printed circuit board, comprising:
- an insulating substrate;
- a connection terminal part formed on the insulating substrate;
- a first plating layer including palladium phosphorus (Pd—P) formed on the insulating substrate and an outer side of the connection terminal part;
- and
- a second plating layer including palladium (Pd) formed on the insulating substrate and an outer side of the first plating layer.
2 more elements
A method of manufacturing a printed circuit board, the method comprising:
- preparing an insulating substrate;
- forming a connection terminal part on the insulating substrate;
- forming a first plating layer including palladium phosphorus (Pd—P) on the insulating substrate and an outer side of the connection terminal part;
- and
- forming a second plating layer including palladium (Pd) on the insulating substrate and an outer side of the first plating layer.
2 more elements
Dependencies are inferred from the claim text.