Metalic laminate and manufacturing method of light emitting diode package using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Gun CHONG, Cheol Ho HEO, Sang Hyuk SON, Dae Hyung YOU
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Abstract
The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.
Claims2
1-9. (canceled)
A metallic laminate, comprising:
- a core layer made of an insulating material and including a heat radiating filler;
- a metal layer disposed on a first surface of the core layer;
- a heat radiating metal layer disposed on a second surface of the core layer;
- and
- a protective metal oxide layer disposed over the entirety of outer exposed surfaces of the heat radiating metal layer and made of an oxide of the heat radiating metal layer, such that corrosion of the heat radiating metal layer is prevented, wherein:
- wherein the entirety of outer exposed surfaces of the heat radiating metal layer includes a side surface of the heat radiating metal layer.
Dependencies are inferred from the claim text.