Carrier-attached copper foil
AssigneeAxis Patent International
InventorsTomota Nagaura, Kazuhiko Sakaguchi
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Abstract
The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.
Claims27
A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate layer is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr-containing layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr-containing layer containing 10-100 μg/dm2 of Cr.
The carrier-attached copper foil according to 1, wherein at least one layer selected from an anticorrosion layer, a chromate treatment layer and a silane coupling treatment layer is formed on a surface of the ultrathin copper layer.
A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate layer is configured with a Ni layer in contact with an interface of the copper foil carrier and a chromate or Cr-plated layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said chromate or Cr-plated layer containing 10-100 μg/dm2 of Cr.
The carrier-attached copper foil according to 10, wherein at least one layer selected from an anticorrosion layer, a chromate treatment layer and a silane coupling treatment layer is formed on a surface of the ultrathin copper layer.
Dependencies are inferred from the claim text.