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US 2012/0171432 A1Published application
Substrate structure and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChul Min Lee, Won Hyung Park, Kyung Jin Heo, Dek Gin Yang, Jin Su Yeo, Sung Wook Chun
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Abstract
Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
Claims16
A substrate structure comprising:
- a base substrate on which a conductive pattern is formed;
- a first plating layer covering the conductive pattern;
- and
- a second plating layer covering the first plating layer, wherein the first plating layer comprises an electroless reduction plating layer.
1 more element
A method of manufacturing a substrate structure comprising:
- forming a conductive pattern on a base substrate;
- forming a first plating layer on the conductive pattern;
- and
- forming a second plating layer on the first plating layer, wherein forming the first plating layer comprises forming an electroless reduction plating layer on the conductive pattern.
1 more element
Dependencies are inferred from the claim text.