Back to results
US 8,808,873 B2Granted
Carrier-attached copper foil and method for manufacturing the same
AssigneeIndustrial Technology Research Institute
InventorsYu-Chung Chen, Yi-Ling Lo, Hung-Kun Lee, Tzu-Ping Cheng
Life of this patent
Estimating the term…
Abstract
In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.
Claims12
A carrier-attached copper foil, comprising:
- a carrier foil comprising nickel alloyed 200 or 300 series austenitic stainless steel with a surface oxide layer;
- and
- a copper foil directly electroplated onto the carrier foil, wherein the copper foil is detachable from the carrier foil after the carrier-attached copper foil is processed with a high-temperature operation.
A method for manufacturing a carrier-attached copper foil, comprising:
- providing a carrier foil comprising nickel alloyed 200 or 300 series austenitic stainless steel with a surface oxide layer, wherein the surface oxide layer is formed by spontaneous oxidation of the carrier foil under atmosphere;
- and
- electroplating a copper foil directly onto the surface oxide layer of the carrier foil to manufacture the carrier-attached copper foil, wherein the copper foil is detachable from the carrier foil after the carrier-attached copper foil is processed with a high-temperature operation.
Dependencies are inferred from the claim text.