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US 8,759,986 B2Granted
Substrate structure and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChul Min Lee, Won Hyung Park, Kyung Jin Heo, Dek Gin Yang, Jin Su Yeo, Sung Wook Chun
Life of this patent
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Abstract
Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
Claims6
A substrate structure comprising:
- a base substrate on which a conductive pattern is formed;
- a first plating layer covering the conductive pattern, the first plating layer made of a silver alloy that consists of 99.000 to 99.999 wt % of silver and 0.001 to 1.0 wt % of at least one metal selected from selenium and lead;
- and
- a second plating layer covering the first plating layer, the second plating layer made of a palladium alloy that consists of 92 to 99.9 wt % of palladium and 0.1 to 8.0 wt % of at least one element selected from phosphorus (P) and boron (B),
- wherein the first plating layer comprises an electroless reduction plating layer.
2 more elements
Dependencies are inferred from the claim text.