Y10T 29/49133
With component orienting
Official title: with component orienting
Y10T29/49133 (With component orienting) appears on 1,343 US grants and 977 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,343
- Published applications
- 977
- Assignees
- 515
- Inventors
- 2,243
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 7 | 0 |
| 1982 | 10 | 0 |
| 1983 | 7 | 0 |
| 1984 | 6 | 0 |
| 1985 | 7 | 0 |
| 1986 | 14 | 0 |
| 1987 | 11 | 0 |
| 1988 | 18 | 0 |
| 1989 | 18 | 0 |
| 1990 | 14 | 0 |
| 1991 | 21 | 0 |
| 1992 | 18 | 0 |
| 1993 | 14 | 0 |
| 1994 | 14 | 0 |
| 1995 | 15 | 0 |
| 1996 | 21 | 0 |
| 1997 | 19 | 0 |
| 1998 | 28 | 0 |
| 1999 | 22 | 0 |
| 2000 | 33 | 0 |
| 2001 | 49 | 44 |
| 2002 | 51 | 81 |
| 2003 | 65 | 68 |
| 2004 | 64 | 92 |
| 2005 | 75 | 83 |
| 2006 | 87 | 91 |
| 2007 | 80 | 69 |
| 2008 | 53 | 81 |
| 2009 | 55 | 72 |
| 2010 | 65 | 55 |
| 2011 | 73 | 57 |
| 2012 | 66 | 41 |
| 2013 | 57 | 32 |
| 2014 | 49 | 32 |
| 2015 | 30 | 42 |
| 2016 | 24 | 5 |
| 2017 | 16 | 12 |
| 2018 | 10 | 7 |
| 2019 | 7 | 1 |
| 2020 | 12 | 5 |
| 2021 | 6 | 3 |
| 2022 | 3 | 2 |
| 2023 | 5 | 0 |
| 2024 | 1 | 2 |
| 2025 | 0 | 0 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for placing a chip for device manufacturing28 Jul 2026US 12,696,398 B2Ciena Corporation
- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
- Panel-molded electronic assemblies31 Mar 2026US 12,593,411 B1Vicor Corporation
- Method of controlling the placement of micro-objects6 Feb 2024US 11,891,299 B2Xerox Corporation
- Panel-molded electronic assemblies5 Sep 2023US 11,751,338 B1Vicor Corporation
- Die bonding system and die bonding method using the same14 Nov 2024US 2024/0375251 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Managing component placement in device assembly3 Oct 2024US 2024/0326252 A1Ciena Corporation
- Method for producing a printed circuit board22 Sep 2022US 2022/0304153 A1NextGin Technology BV
- Method of controlling the placement of micro-objects3 Feb 2022US 2022/0033257 A1Palo Alto Research Center Incorporated
- Methods for attachment and devices produced using the methods16 Sep 2021US 2021/0289680 A1Alpha Assembly Solutions Inc.
Most cited
By later US patents
- Radio frequency circuit and memory in thin flexible package895US 5,528,222 AInternational Business Machines Corporation · 1996
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Method of producing a single piece package for semiconductor die427US 5,674,785 AMicron Technology, Inc. · 1997
- Method for coplanar integration of semiconductor ic devices408US 4,990,462 AAdvanced Micro Devices, Inc. · 1991
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998