Die bonding system and die bonding method using the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Chu WU, Jen-Yuan Chang
Life of this patent
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Abstract
A die bonding system includes a pick-and-placer, a carrier fixing platform and a transfer platform. The pick-and-placer includes a suction head for picking up a die and placing the die on a carrier. The carrier fixing platform is used to fix the carrier. The carrier has a bearing surface arranged to face downward or to be inclined at an angle relative to a horizontal plane. The transfer platform includes a driver, the pick-and-placer is arranged on the transfer platform, and the driver controls the pick-and-placer to move to a location under the carrier or tilt the angle relative to the horizontal plane, and the pick-and-placer bonds the die to the bearing surface of the carrier from a location under the carrier or at the angle of tilt.
Claims20
A die bonding system comprising:
- a pick-and-placer for picking up a die and placing the die on a carrier;
- a carrier fixing platform for fixing the carrier, the carrier having a bearing surface facing downward;
- and
- a transfer platform for controlling the pick-and-placer to move to a location under the carrier, and the pick-and-placer bonds the die to the bearing surface.
A die bonding system comprising:
- a pick-and-placer for picking up a die and placing the die on a carrier;
- a carrier fixing platform for fixing the carrier, the carrier having a bearing surface tilted for an angle relative to a horizontal plane;
- and
- a transfer platform for controlling the pick-and-placer to bond the die to the bearing surface of the carrier.
A die bonding method, comprising:
- picking up a die through a pick-and-placer;
- and
- bonding the die to a bearing surface of a carrier through the pick-and placer;
- wherein the carrier is fixed on a platform and the bearing surface is facing downward or inclined at an angle relative to a horizontal plane.
Dependencies are inferred from the claim text.