Method for producing a printed circuit board

A method for making a printed circuit board, comprising the steps of:

• forming, with a router, a slot in a substrate, the substrate having multiple layers of traces and insulators including an internal trace, the substrate having a first side and a second side and having at least three layers, the slot extending through at least two of the at least three layers from the first side and terminating prior to intersecting the second side of the substrate such that the slot is blind, the slot having a length and a width, with the length being greater than the width, the slot having a bottom and a perimeter sidewall surrounding the slot, wherein at least a portion of the perimeter sidewall is linear along the length of the slot;
• applying a laser to the bottom of the slot;
• coating the perimeter sidewall of the substrate with a conductive layer;
• and
• separating the conductive layer into at least two conductive segments that are electrically isolated along the perimeter sidewall of the substrate for providing an electrical connection between the internal trace and another internal or external trace.