Y10S 148/135
Removal of substrate
Y10S148/135 (Removal of substrate) appears on 296 US grants and 25 published applications in this corpus.
Search patents in Y10S- Granted patents
- 296
- Published applications
- 25
- Assignees
- 113
- Inventors
- 423
- Latest grant
- 22 Mar 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 4 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 17 | 0 |
| 1991 | 14 | 0 |
| 1992 | 15 | 0 |
| 1993 | 28 | 0 |
| 1994 | 27 | 0 |
| 1995 | 32 | 0 |
| 1996 | 25 | 0 |
| 1997 | 32 | 0 |
| 1998 | 14 | 0 |
| 1999 | 10 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 4 |
| 2003 | 1 | 4 |
| 2004 | 3 | 7 |
| 2005 | 2 | 6 |
| 2006 | 3 | 2 |
| 2007 | 1 | 0 |
| 2008 | 2 | 1 |
| 2009 | 5 | 0 |
| 2010 | 3 | 0 |
| 2011 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Flexible and elastic dielectric integrated circuit22 Mar 2011US 7,911,012 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Stress-controlled dielectric integrated circuit26 Oct 2010US 7,820,469 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Flexible and elastic dielectric integrated circuit27 Jul 2010US 7,763,948 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Membrane IC fabrication2 Mar 2010US 7,670,893 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Lithography device for semiconductor circuit pattern generation10 Nov 2009US 7,615,837 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Flexible and elastic dielectric integrated circuit11 Dec 2008US 2008/0302559 A1Elm Technology Corporation
- Method of producing a complex structure by assembling stressed structures29 Jun 2006US 2006/0141742 A1Commissariat A L' Energie Atomique
- Method of manufacturing an external force detection sensor25 May 2006US 2006/0110843 A1Murata Manufacturing Co., Ltd.
- Semiconductor device and method of manufacturing same13 Oct 2005US 2005/0227438 A1Denso Corporation
- Methodof making an integrated circuit11 Aug 2005US 2005/0176174 A1Elm Technology Corporation
Most cited
By later US patents
- Single crystal silicon arrayed devices for display panels540US 5,317,236 AKopin Corporation · 1994
- Method of making a three-dimensional integrated circuit501US 5,563,084 AFraunhofer-Gesellschaft zur F orderung der angewandten Forschung e.V. · 1996
- Method of producing sheets of crystalline material345US 4,727,047 AMassachusetts Institute of Technology · 1988
- Liquid crystal display having essentially single crystal transistors pixels and driving circuits339US 5,206,749 AKopin Corporation · 1993
- Multilevel integrated circuits employing fused oxide layers334US 4,829,018 A1989