Methodof making an integrated circuit

A method of making an integrated circuit comprising:

• providing a substrate having a principal surface;
• forming circuit devices on the principal surface;
• and
• forming a stress-controlled dielectric membrane overlying the circuit devices.

A method of making an integrated circuit comprising:

• providing a substrate having a principal surface;
• forming circuit devices on the principal surface;
• and
• forming a stress-controlled dielectric layer overlying the circuit devices.

A method of making an integrated circuit comprising:

• forming on a substrate circuitry having active devices;
• and
• forming a stress-controlled dielectric membrane overlying said active devices;
• wherein the integrated circuit is able to have a major portion of the substrate removed throughout a full extent thereof while retaining its structural integrity.

A method of making an integrated circuit comprising:

• forming on a substrate circuitry having active devices;
• and
• forming a stress-controlled dielectric layer overlying said active devices;
• wherein the integrated circuit is able to have a major portion of the substrate removed throughout a full extent thereof while retaining its structural integrity.

A method of making an integrated circuit comprising:

• forming on a substrate circuitry having active devices;
• forming a stress-controlled dielectric layer overlying said active devices;
• and
• removing a major portion of the substrate throughout a full extent thereof without impairing the structural integrity of the integrated circuit.

A method of making an integrated circuit comprising:

• providing a substrate having a principal surface;
• forming circuit devices on the principal surface;
• and
• forming a low stress dielectric layer overlying the circuit devices.

A method of fabricating circuitry comprising the steps of:

• providing a substrate having a principal surface;
• forming circuit devices on the principal surface;
• forming a low stress dielectric layer overlying the circuit devices;
• and
• forming interconnections within the low stress dielectric layer between the circuit devices, wherein the interconnections are at least one of electrical and optical interconnections.

A method of fabricating interconnect circuitry comprising the steps of:

• providing a substrate having a principal surface;
• forming a low stress dielectric layer overlying the principal surface;
• and
• forming interconnections within the low stress dielectric layer, wherein the interconnections are at least one of electrical and optical interconnections.

A method of making an integrated circuit comprising:

• providing a substrate having a principal surface;
• forming circuit devices on the principal surface;
• and
• forming an elastic dielectric layer overlying the circuit devices.

A method of making an integrated circuit comprising:

• forming on a substrate circuitry having active devices;
• and
• forming an elastic dielectric layer overlying said active devices;
• wherein the integrated circuit is able to have a major portion of the substrate removed throughout a full extent thereof while retaining its structural integrity.

A method of making an integrated circuit comprising:

• forming on a substrate circuitry having active devices;
• forming an elastic dielectric layer overlying said active devices;
• and
• removing a major portion of the substrate throughout a full extent thereof without impairing the structural integrity of the integrated circuit.