Method of producing a complex structure by assembling stressed structures
AssigneeCommissariat a l'Energie Atomique
InventorsFranck Fournel, Hubert Moriceau, Philippe Montmayeul
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Abstract
The invention relates to a method of producing a complex microelectronic structure, in which two basic microelectronic structures (1, 3) are assembled at the two respective connecting faces (3) thereof. The invention is characterised in that, before assembly, a difference is created in the tangential stress state between the two faces to be assembled, said difference being selected such as to produce a pre-determined stress state within the assembled structure under given conditions in relation to the assembly conditions.
Claims35
Method of producing a complex structure wherein respective connecting faces of two basic structures (1, 3;
- 1, 3, 19;
- 20, 21, 23, 25) are brought into contact and assembled, characterized in that, before bringing them into contact, a tangential stress state difference imposed by curving each of the two basic structures to be assembled is created between the two faces to be assembled by applying mechanical forces to each of the two structures, this difference being selected to obtain within the assembled structure a predetermined stress state under given conditions relative to the assembly conditions.
Dependencies are inferred from the claim text.