H10P 72/1904
Specially adapted for containing chips, dies or ics
Official title: {specially adapted for containing chips, dies or ICs}
H10P72/1904 (Specially adapted for containing chips, dies or ics) appears on 80 US grants and 73 published applications in this corpus.
Search patents in H10P- Granted patents
- 80
- Published applications
- 73
- Assignees
- 68
- Inventors
- 230
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 0 | 2 |
| 2003 | 1 | 2 |
| 2004 | 2 | 0 |
| 2005 | 1 | 2 |
| 2006 | 0 | 2 |
| 2007 | 1 | 2 |
| 2008 | 2 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 1 | 2 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 1 | 1 |
| 2015 | 2 | 3 |
| 2016 | 4 | 3 |
| 2017 | 1 | 1 |
| 2018 | 1 | 3 |
| 2019 | 4 | 4 |
| 2020 | 5 | 4 |
| 2021 | 1 | 8 |
| 2022 | 5 | 6 |
| 2023 | 2 | 5 |
| 2024 | 6 | 7 |
| 2025 | 7 | 6 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Frame cassette with internal cover cases6 Oct 2026US 12,757,677 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Module tray for semiconductor device29 Sep 2026US 12,751,243 B2Samsung Electronics Co., Ltd.
- Methods and systems for temperature control for a substrate28 Oct 2025US 12,456,638 B2APPLIED Materials.Inc.
- Semiconductor die carrier structure3 Jun 2025US 12,322,623 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Cover plate for a poka-yoke bulk bin system15 Apr 2025US 12,275,041 B1Texas Instruments Incorporated
- Film tray semiconductor chip carrier17 Sep 2026US 2026/0282817 A1Arm Limited
- Passage chamber10 Sep 2026US 2026/0271663 A1Samsung Display Co., Ltd.
- Mapping of a replacement parts storage container2 Apr 2026US 2026/0096390 A1APPLIED Materials.Inc.
- Automatic handling system and method of operating the same16 Oct 2025US 2025/0321573 A1Nanya Technology Corporation
- Semiconductor die carrier structure11 Sep 2025US 2025/0285897 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Substrate transport box136US 4,901,853 AAvantek, Inc. · 1990
- Apparatus and method for protecting integrated circuits91US 4,564,880 AMotorola, Inc. · 1986
- UV light sensitive die-pac for securing semiconductor dies during transport47US 5,590,787 AMicron Technology, Inc. · 1997
- IC carrier with shaft coupling37US 5,109,980 AYamaichi Electric Mfg. Co., Ltd. · 1992
- Memory module container34US 5,441,150 AMA Laboratories, Inc. · 1995