H10N 30/875

Further connection or lead arrangements

Official title: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins}

H10N30/875 (Further connection or lead arrangements) appears on 739 US grants and 879 published applications in this corpus.

Search patents in H10N
Granted patents
739
Published applications
879
Assignees
336
Inventors
1,719
Latest grant
15 Sep 2026

Filings by year

H10N 30/875: granted patents and published applications per publication year
YearGranted patentsPublished applications
197610
197710
197800
197900
198000
198100
198210
198360
198440
198510
198620
198720
198820
198920
199000
199110
199200
199320
199420
199510
199600
199720
199810
199950
200070
2001100
200277
200347
2004108
200559
200668
2007810
200849
20091116
20101423
20111020
20121918
20131450
20142240
20154450
20163345
20173951
20183586
20196893
20207374
20215675
20225142
20235543
20243245
20253636
20263014

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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