Method of manufacturing an electronic multilayer component

A method of manufacturing a plurality of electronic multilayer components, each of which comprises alternately stacked electrically conductive and electrically insulating layers, the electrically conductive layers being electrically connected in a periodically alternate arrangement to substantially opposite edges of the multilayer component, said method comprising the following steps:

• (a) providing a substrate which is endowed on one face with a regular pattern of substantially parallel elongated surface protrusions separated by intervening valleys;
• (b) providing a flux of electrically conductive material in a direction D.sub.1 subtending an angle of less than 90.degree. with the substrate face and extending substantially perpendicular to the surface protrusions, and subsequently covering the electrically conductive layer thus formed with an electrically insulating layer;
• (c) providing a flux of electrically conductive material in a direction D.sub.2 subtending an angle of less than 90.degree. with the substrate face and having an in-plane component which is directed substantially opposite to the in-plane component of direction D.sub.1, and subsequently covering the electrically conducting layer thus formed with an electrically insulating layer;
• (d) repeating steps (b) and (c), in alternation, and finishing with step (b) or (c), as desired;
• (e) dividing the substrate into strips, each strip including a surface protrusion, by severing the substrate along a series of planes, each plane extending along a valley in a direction substantially parallel to the surface protrusions, each strip thus acquiring an exposed side face running along each of the two planes defining the strip;
• and
• (f) providing electrically conductive material upon each exposed side face, so as to provide mutual electrical contact between the electrically conductive layers terminating in that exposed side face.