Piezoelectric sensor and haptic feedback apparatus

A haptic feedback apparatus, comprising a piezoelectric sensor, wherein the piezoelectric sensor comprises:

• a base substrate;
• at least one piezoelectric device located on the base substrate;
• an organic insulation layer located on one side, facing away from the base substrate, of the piezoelectric device, wherein the organic insulation layer is provided with a first via hole, and an orthographic projection, on the base substrate, of the first via hole overlaps an orthographic projection, on the base substrate, of the piezoelectric device;
• an inorganic insulation layer located on one side, facing away from the base substrate, of the organic insulation layer, wherein the inorganic insulation layer does not overlap at least a portion of the first via hole;
• and
• a wiring layer located on one side, facing away from the base substrate, of the inorganic insulation layer, wherein the wiring layer comprises a wire, one end of the wire being electrically connected to the piezoelectric device by means of at least the portion of the first via hole;
• wherein the piezoelectric device comprises:
• a first electrode between the base substrate and the organic insulation layer, a piezoelectric layer between the first electrode and the organic insulation layer, and a second electrode between the piezoelectric layer and the organic insulation layer;
• wherein
• the inorganic insulation layer covers a side wall of the first via hole and the second electrode exposed out of the first via hole, a portion, covering the second electrode, of the inorganic insulation layer is provided with at least one second via hole, and the wiring layer is electrically connected to the second electrode by means of the first via hole and the second via hole.

A piezoelectric sensor, comprising:

• a base substrate;
• at least one piezoelectric device located on the base substrate;
• an organic insulation layer located on one side, facing away from the base substrate, of the piezoelectric device, wherein the organic insulation layer is provided with a first via hole, and an orthographic projection, on the base substrate, of the first via hole overlaps an orthographic projection, on the base substrate, of the piezoelectric device;
• an inorganic insulation layer located on one side, facing away from the base substrate, of the organic insulation layer, wherein the inorganic insulation layer does not overlap at least a portion of the first via hole;
• and
• a wiring layer located on one side, facing away from the base substrate, of the inorganic insulation layer, wherein the wiring layer comprises a wire, one end of the wire being electrically connected to the piezoelectric device by means of at least the portion of the first via hole;
• wherein the piezoelectric device comprises:
• a first electrode between the base substrate and the organic insulation layer, a piezoelectric layer between the first electrode and the organic insulation layer, and a second electrode between the piezoelectric layer and the organic insulation layer;
• the piezoelectric sensor further comprises:
• a binding electrode arranged on the same layer as the first electrode, wherein the binding electrode is arranged near an edge of the base substrate, the binding electrode is configured to be connected to a drive voltage input end, and a voltage signal input from the drive voltage input end is an alternating voltage signal;
• another end of the wire is electrically connected to the binding electrode by means of a third via hole provided on the inorganic insulation layer and the organic insulation layer;
• and
• the piezoelectric sensor further comprises:
• a lead electrode arranged on the same layer as the first electrode, wherein the lead electrode is electrically connected to the first electrode, the lead electrode is configured to be connected to an earth voltage input end, and a voltage signal input from the earth voltage input end is an earth voltage signal.