H10N 30/078
By sol-gel deposition
Official title: by sol-gel deposition
H10N30/078 (By sol-gel deposition) appears on 457 US grants and 535 published applications in this corpus.
Search patents in H10N- Granted patents
- 457
- Published applications
- 535
- Assignees
- 127
- Inventors
- 533
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 1 |
| 2002 | 13 | 12 |
| 2003 | 9 | 11 |
| 2004 | 9 | 18 |
| 2005 | 5 | 25 |
| 2006 | 12 | 23 |
| 2007 | 17 | 12 |
| 2008 | 14 | 13 |
| 2009 | 20 | 15 |
| 2010 | 10 | 19 |
| 2011 | 11 | 40 |
| 2012 | 9 | 38 |
| 2013 | 25 | 44 |
| 2014 | 49 | 32 |
| 2015 | 40 | 30 |
| 2016 | 30 | 22 |
| 2017 | 23 | 39 |
| 2018 | 22 | 22 |
| 2019 | 20 | 26 |
| 2020 | 20 | 17 |
| 2021 | 13 | 21 |
| 2022 | 22 | 10 |
| 2023 | 16 | 18 |
| 2024 | 8 | 9 |
| 2025 | 10 | 12 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Piezoelectric assembly and process of forming a piezoelectric assembly9 Jun 2026US 12,652,959 B2TDK Electronics Co., Ltd.
- Semiconductor substrate processing tool with hot plate chamber28 Apr 2026US 12,615,963 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laminated substrate with piezoelectric thin film, piezoelectric thin film element and method for manufacturing this element13 Jan 2026US 12,527,226 B2Sciocs Company Limited
- Piezoelectric element, droplet dispensing head, actuator, and vibrator30 Sep 2025US 12,433,167 B2Seiko Epson Corporation
- Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems9 Sep 2025US 12,414,474 B2Baker Hughes Oilfield Operations LLC
- Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus13 Aug 2026US 2026/0239883 A1Seiko Epson Corporation
- Piezoelectric element, liquid ejection head, and liquid ejection apparatus21 May 2026US 2026/0143970 A1Seiko Epson Corporation
- Piezoelectric element and liquid ejection head2 Apr 2026US 2026/0096348 A1Seiko Epson Corporation
- Piezoelectric element and liquid ejection head2 Apr 2026US 2026/0096349 A1Seiko Epson Corporation
- Piezoelectric element and liquid ejection head2 Apr 2026US 2026/0096350 A1Seiko Epson Corporation
Most cited
By later US patents
- Piezoelectric thin film, method for producing the same, and ink jet recording head using the thin film73US 6,140,746 ASeiko Epson Corporation · 2000
- Fiber-optic piezoelectric devices49US 5,135,295 AQueen's University at Kingston · 1992
- Process for fabricating materials for ferroelectric, high dielectric constant, and integrated circuit applications48US 5,423,285 AOlympus Optical Co., Ltd. · 1995
- Microdevice for sensing a force43US 5,209,119 ARegents of the University of Minnesota · 1993
- Thin piezoelectric film element, process for the preparation thereof and ink jet recording head using thin piezoelectric film element42US 6,097,133 ASeiko Epson Corporation · 2000