H10N 19/00
Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric
Official title: Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
H10N19/00 (Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric) appears on 481 US grants and 606 published applications in this corpus.
Search patents in H10N- Granted patents
- 481
- Published applications
- 606
- Assignees
- 310
- Inventors
- 1,231
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 3 |
| 2002 | 7 | 6 |
| 2003 | 4 | 7 |
| 2004 | 6 | 4 |
| 2005 | 1 | 11 |
| 2006 | 6 | 8 |
| 2007 | 4 | 6 |
| 2008 | 1 | 8 |
| 2009 | 2 | 8 |
| 2010 | 7 | 12 |
| 2011 | 5 | 13 |
| 2012 | 10 | 13 |
| 2013 | 7 | 24 |
| 2014 | 15 | 34 |
| 2015 | 16 | 29 |
| 2016 | 27 | 42 |
| 2017 | 32 | 37 |
| 2018 | 38 | 59 |
| 2019 | 35 | 34 |
| 2020 | 37 | 34 |
| 2021 | 27 | 26 |
| 2022 | 19 | 28 |
| 2023 | 22 | 43 |
| 2024 | 29 | 43 |
| 2025 | 28 | 45 |
| 2026 | 24 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparel thermo-regulatory system15 Sep 2026US 12,733,697 B2NIKE, Inc.
- Apparatus and method of operating a gas pump1 Sep 2026US 12,723,578 B2Torramics Inc.
- Transistor-scale thermoelectric devices for refrigeration of integrated circuits11 Aug 2026US 12,707,971 B2Intel Corporation
- Pyroelectric device for a semiconductor device4 Aug 2026US 12,701,917 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power regeneration in a memory device28 Jul 2026US 12,696,685 B2Micron Technology, Inc.
- Fixed-Footprint Thermoelectric Systems with Variable Junction Density1 Oct 2026US 2026/0305170 A1
- Thermoelectric modules with enhanced heat-transfer and power density1 Oct 2026US 2026/0305171 A1University of South Carolina
- On-die temperature control for semiconductor die assemblies and associated systems and methods24 Sep 2026US 2026/0293525 A1Micron Technology, Inc.
- Modular geothermal power generation system17 Sep 2026US 2026/0282747 A1Shenzhen University
- Thermoelectric module10 Sep 2026US 2026/0271620 A1KYOCERA Corporation
Most cited
By later US patents
- Integrated silicon vacuum micropackage for infrared devices149US 5,895,233 AHoneywell Inc. · 1999
- Two dimensional thermoelectric cooler configuration122US 6,000,225 AInternational Business Machines Corporation · 1999
- Microstructure design for high IR sensitivity115US 5,286,976 AHoneywell Inc. · 1994
- Method for making a wafer-pair having sealed chambers108US 6,036,872 AHoneywell Inc. · 2000
- Low power infrared scene projector array and method of manufacture99US 5,600,148 AHoneywell Inc. · 1997