Fixed-Footprint Thermoelectric Systems with Variable Junction Density

Abstract

A thermoelectric cooler module comprises a first electrically conductive plate. A second electrically conductive plate is arranged substantially parallel to the first electrically conductive plate and spaced apart therefrom by a predetermined distance. A plurality of semiconductor pellet pairs are disposed between the first electrically conductive plate and the second electrically conductive plate. Each semiconductor pellet pair comprises a P-type semiconductor pellet and an N-type semiconductor pellet. A plurality of conductive traces are disposed on surfaces of the first electrically conductive plate and the second electrically conductive plate. The conductive traces electrically couple the semiconductor pellet pairs in series to form a continuous electrical path. A positive terminal is electrically coupled to the continuous electrical path. A neutral terminal is electrically coupled to the continuous electrical path. Adjacent semiconductor pellets are separated by gaps of predetermined width to provide electrical isolation and accommodate thermal expansion.

Dependencies are inferred from the claim text.