Thermoelectric modules with enhanced heat-transfer and power density

A thermoelectric cooler (TEC) module for transferring heat from one side to the other, using Peltier effect, to controllably create temperature difference between two sides of the module, comprising:

• a pair of dielectric material contact substrates, with said contact substrates formed in opposing parallel positions, and with each contact substrate having a respectively outward facing surface;
• a respective plurality of fluid passages formed directly in each of said outward facing surfaces, and comprising at least one of custom-patterned grooves, pins, and other geometries integrated into said outward facing surfaces;
• and
• a plurality of thermoelectric (TE) legs, arranged in parallel, and directly captured between said pair of contact substrates without intervening layers of thermal interface material and without intermediate ceramic plates.

Methodology for providing an improved thermoelectric module for transferring heat from one side to the other, using Peltier effect, to provide for both cooling and heating, comprising:

• providing a pair of ceramic plates, configured in opposing parallel positions with each plate forming a respective outward facing surface;
• forming a plurality of fluid passages directly in each respective outward facing surface of said ceramic plates by removing solid material from the ceramic plates;
• and
• providing a plurality of thermoelectric (TE) elements directly captured between said pair of ceramic plates, to configure the TE elements for being relatively closer to the plurality of fluid passages, whereby the module has reduced thermal resistance for enhanced performance.