H10H 29/8323
Transparent materials
Official title: {Transparent materials}
H10H29/8323 (Transparent materials) appears on 14 US grants and 125 published applications in this corpus.
Search patents in H10H- Granted patents
- 14
- Published applications
- 125
- Assignees
- 42
- Inventors
- 352
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 2 |
| 2021 | 0 | 0 |
| 2022 | 1 | 4 |
| 2023 | 2 | 6 |
| 2024 | 0 | 5 |
| 2025 | 4 | 54 |
| 2026 | 5 | 52 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Display substrate and driving method therefor, and display device2 Jun 2026US 12,646,442 B2Boe Technology Group Co., Ltd.
- Composite cathode contact for monolithically integrated micro-LEDs, mini-LEDs and LED arrays24 Mar 2026US 12,588,326 B2Lumileds Singapore Pte. Ltd.
- Display device and method of manufacturing the same17 Feb 2026US 12,557,445 B2Samsung Display Co., Ltd.
- Image display device manufacturing method including providing substrate including circuit and insulating film, forming conductive layer on insulating film, and forming semiconductor layer on conductive layer3 Feb 2026US 12,543,419 B2Nichia Corporation
- Display device using semiconductor light-emitting element6 Jan 2026US 12,520,646 B2LG Electronics Inc.
- Display device including buffer layer, method of manufacturing the same and electronic device including the same8 Oct 2026US 2026/0314149 A1Samsung Display Co., Ltd.
- Displays with Pinhole Openings17 Sep 2026US 2026/0282567 A1Apple Inc.
- Method for processing an arrangement having µleds and arrangement10 Sep 2026US 2026/0271450 A1
- Display device, electronic device and method for manufacturing display device10 Sep 2026US 2026/0271457 A1Samsung Display Co., Ltd.
- Light-emitting substrate and manufacturing method therefor, and display apparatus3 Sep 2026US 2026/0262337 A1Beijing BOE Technology Development Co., Ltd.
Most cited
By later US patents
- Radiation-emitting chip comprising at least one semiconductor body5US 8,067,783 B2OSRAM Opto Semiconductors GmbH · 2011
- Method for producing an optoelectronic device comprising a plurality of gallium nitride diodes2US 10,734,439 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2020
- Micro light-emitting diode displays having colloidal or graded index quantum dot films1US 11,515,297 B2Intel Corporation · 2022
- Display device using semiconductor light-emitting element1US 12,520,646 B2LG Electronics Inc. · 2026