Method for processing an arrangement having µleds and arrangement

A method for processing an arrangement with a plurality of vertical optoelectronic components, the method comprising:

• providing the plurality of vertical optoelectronic components onto a carrier substrate, the plurality of vertical optoelectronic components comprising a contact area on a top surface opposite the carrier substrate;
• embedding the plurality of vertical optoelectronic components into a photoactive material, the photoactive material covering spaces between adjacent optoelectronic components of the plurality of vertical optoelectronic components and the top surface;
• illuminating portions of the photoactive material above the top surface comprising at least partially the contact area;
• developing the photoactive material thereby removing portions of the photoactive material such that a portion of the top surface comprising at least partially the contact area is exposed and a portion of an inactivated photoactive material extending onto the top surface comprises a curvature and such that a thickness of the photoactive material partially increases towards an exposed contact are;
• and
• providing a conductive transparent layer on the remaining photoactive material and the exposed portion of the top surface to electrically contact the contact area.

An arrangement comprising:

• a carrier substrate comprising a plurality of contact leads;
• a plurality of vertical optoelectronic components arranged on the carrier substrate such that a first contact area of each of the plurality of vertical optoelectronic components connects a respective one of the plurality of contact leads, wherein each of the plurality of vertical optoelectronic components comprises a second contact area opposite the first contact area;
• a non-conductive inactivated photoactive material arranged on the carrier substrate embedding the plurality of vertical optoelectronic components, wherein a portion of the inactivated photoactive material extends onto a top surface of a respective plurality of vertical optoelectronic components, leaving the second contact area partially exposed, and wherein the portion of the inactivated photoactive material extending onto the top surface comprises a curvature such that a thickness of the photoactive material partially increases towards an exposed second contact area;
• and
• a transparent conductive layer covering the inactivated photoactive material and the exposed second contact area of the plurality of vertical optoelectronic components.