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US 8,067,783 B2Granted
Radiation-emitting chip comprising at least one semiconductor body
AssigneeOSRAM Opto Semiconductors GmbH
InventorRalph Wirth
Life of this patent
Estimating the term…
Abstract
A chip includes at least one semiconductor body having a radiation-emitting region, and at least one first contact region which is provided for making electrical contact with the semiconductor body and is spaced apart laterally from the radiation-emitting region. An electrically conductive first contact layer which is transmissive to the emitted radiation and which connects a surface of the semiconductor body, is situated on the radiation exit side of the chip to the first contact region. The surface is free of the radiation-absorbing contact structures.
Claims22
A chip comprising:
- at least one semiconductor body having a radiation-emitting region;
- at least one first contact region which is provided for making electrical contact with the at least one semiconductor body and is spaced apart laterally from the radiation-emitting region;
- an electrically conductive first contact layer, which is transmissive to emitted radiation and which connects a surface of the at least one semiconductor body that is situated on a radiation exit side of the chip to the at least one first contact region, the surface being free of radiation-absorbing contact structures;
- and
- a second contact layer that connects the at least one semiconductor body to a second contact region for making electrical contact with the at least one semiconductor body, wherein the second contact layer contains a TCO.
2 more elements
A chip comprising:
- at least one semiconductor body having a radiation-emitting region;
- at least one first contact region which is provided for making electrical contact with the at least one semiconductor body and is spaced apart laterally from the radiation-emitting region;
- an electrically conductive first contact layer, which is transmissive to emitted radiation and which connects a surface of the at least one semiconductor body that is situated on a radiation exit side of the chip to the at least one first contact region, the surface being free of radiation-absorbing contact structures, wherein the at least one first contact region and the at least one semiconductor body are arranged on a common carrier;
- and
- a second contact layer that connects the at least one semiconductor body to a second contact region for making electrical contact with the at least one semiconductor body, the second contact region being applied to the common carrier,
- wherein the at least one first contact region is disposed downstream of the second contact region in a vertical direction proceeding from the common carrier.
3 more elements
A chip comprising:
- at least one semiconductor body having a radiation-emitting region;
- at least one first contact region which is provided for making electrical contact with the at least one semiconductor body and is spaced apart laterally from the radiation-emitting region;
- an electrically conductive first contact layer, which is transmissive to emitted radiation and which connects a surface of the at least one semiconductor body that is situated on a radiation exit side of the chip to the at least one first contact region, the surface being free from radiation-absorbing contact structures;
- and
- a second contact layer that connects the at least one semiconductor body to a second contact region for making electrical contact with the at least one semiconductor body, wherein the second contact layer is transmissive to the emitted radiation.
2 more elements
Dependencies are inferred from the claim text.