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H10H 20/8508

Package substrates

Official title: {Package substrates, e.g. submounts}

H10H20/8508 (Package substrates) appears on 27 US grants and 97 published applications in this corpus.

Search patents in H10H

Granted patents: 27
Published applications: 97
Assignees: 57
Inventors: 242
Latest grant: 11 Aug 2026

Filings by year

H10H 20/8508: granted patents and published applications per publication year
Year	Granted patents	Published applications
2002	0	1
2003	0	1
2004	0	1
2005	2	0
2006	0	2
2007	0	1
2008	0	1
2009	0	2
2010	2	4
2011	3	1
2012	2	4
2013	1	3
2014	4	2
2015	2	3
2016	1	0
2017	3	1
2018	0	0
2019	0	0
2020	0	2
2021	1	0
2022	0	0
2023	0	3
2024	0	6
2025	2	22
2026	4	37

By publication year. 2026 runs to 8 Oct.

Recent patents

Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device11 Aug 2026US 12,707,771 B2ams-OSRAM International GmbH
Spontaneous and stimulated emission devices based on relaxed III-nitride materials30 Jun 2026US 12,671,232 B2Opnovix Corp.
On-chip integration of optical components with photonic wire bonds and/or lenses16 Jun 2026US 12,658,668 B2The University of British Columbia
Relaxed Wurtzite Ingan layers3 Feb 2026US 12,542,413 B2Opnovix Corp.
Display apparatus having display module and manufacturing method thereof9 Sep 2025US 12,414,421 B2Samsung Electronics Co., Ltd.

Most cited

By later US patents