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US 2026/0314121 A1Published application
Semiconductor device arrangement
AssigneeEnnostar Corporation
InventorWei-Yu Chen
Life of this patent
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Abstract
A semiconductor device arrangement includes a carrier, an adhesive portion, and a semiconductor device. The carrier has a first surface. The adhesive portion is disposed on the first surface. The semiconductor device is disposed on the adhesive portion and has a second surface. The first surface has a first normal, the second surface has a second normal, and an included angle between the first normal and the second normal is greater than 5 degrees and less than 45 degrees.
Claims20
A semiconductor device arrangement, comprising:
- a carrier having a first surface;
- an adhesive portion disposed on the first surface;
- and
- a semiconductor device disposed on the adhesive portion and having a second surface;
- wherein the first surface has a first normal, the second surface has a second normal, and an included angle between the first normal and the second normal is greater than 5 degrees and less than 45 degrees.
2 more elements
A semiconductor device arrangement, comprising:
- a carrier having a first surface;
- an adhesive portion disposed on the first surface;
- a plurality of semiconductor devices disposed on the adhesive portion, wherein each of the plurality of semiconductor devices comprises a second surface;
- and
- a plurality of connecting portions disposed on the first surface, wherein each of the plurality of connecting portions is located between two adjacent ones of the plurality of semiconductor devices;
- wherein the first surface has a first normal, the second surface has a second normal, and an included angle between the first normal and the second normal is greater than 5 degrees and less than 45 degrees.
3 more elements
Dependencies are inferred from the claim text.