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US 2026/0280225 A1Published application
Semiconductor element mounting substrate
AssigneeNiterra Co., Ltd.
InventorsKenzo USAMI, Yosuke KONDO, Tatsunori MURASE, Mitsuru NISHIMURA, Yukihiro WATANABE, Isuzu SANO
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Abstract
A semiconductor element mounting substrate includes a base formed of a metal, an electrode to be connected to a semiconductor element, and a protective layer disposed between the base and the electrode and formed of a material that is more corrosion resistant than the metal forming the base.
Claims10
A semiconductor element mounting substrate comprising:
- a base formed of a metal;
- an electrode to be connected to a semiconductor element;
- an insulating layer disposed between the base and the electrode;
- and
- protective layer disposed between the base and the insulating layer and formed of a material that is more corrosion resistant than the metal forming the base,
- wherein the thickness of the insulating layer is 50 micrometers or less.
3 more elements
Dependencies are inferred from the claim text.