H10F 77/50
Encapsulations or containers
Official title: Encapsulations or containers (for photovoltaic modules H10F19/80)
H10F77/50 (Encapsulations or containers) appears on 2,460 US grants and 2,853 published applications in this corpus.
Search patents in H10F- Granted patents
- 2,460
- Published applications
- 2,853
- Assignees
- 943
- Inventors
- 5,211
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 7 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 15 | 0 |
| 1988 | 10 | 0 |
| 1989 | 8 | 0 |
| 1990 | 13 | 0 |
| 1991 | 17 | 0 |
| 1992 | 21 | 0 |
| 1993 | 16 | 0 |
| 1994 | 17 | 0 |
| 1995 | 11 | 0 |
| 1996 | 18 | 0 |
| 1997 | 20 | 0 |
| 1998 | 27 | 0 |
| 1999 | 30 | 0 |
| 2000 | 32 | 0 |
| 2001 | 24 | 11 |
| 2002 | 39 | 60 |
| 2003 | 61 | 73 |
| 2004 | 66 | 124 |
| 2005 | 70 | 160 |
| 2006 | 81 | 164 |
| 2007 | 80 | 121 |
| 2008 | 81 | 155 |
| 2009 | 87 | 118 |
| 2010 | 105 | 100 |
| 2011 | 81 | 78 |
| 2012 | 72 | 81 |
| 2013 | 66 | 111 |
| 2014 | 86 | 92 |
| 2015 | 91 | 153 |
| 2016 | 114 | 128 |
| 2017 | 115 | 147 |
| 2018 | 107 | 151 |
| 2019 | 135 | 152 |
| 2020 | 141 | 122 |
| 2021 | 99 | 110 |
| 2022 | 83 | 131 |
| 2023 | 84 | 84 |
| 2024 | 86 | 94 |
| 2025 | 69 | 77 |
| 2026 | 41 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Image sensor package with stray light directing microstructure component6 Oct 2026US 12,757,515 B2Pixart Imaging Inc.
- Optical sensing apparatus8 Sep 2026US 12,733,289 B2Artilux, Inc.
- Two-part molding of device packages with spacers8 Sep 2026US 12,733,537 B2NXP USA, Inc.
- Polymer, copolymer, ink, ink container, image forming method, image forming device, and backsheet for solar cell18 Aug 2026US 12,709,654 B2Ricoh Company, Ltd.
- Insulation module14 Jul 2026US 12,684,895 B2Rohm Co., Ltd.
- Solar cell8 Oct 2026US 2026/0314114 A1Jinko Solar (Haining) Co., Ltd.
- Package structure1 Oct 2026US 2026/0304995 A1Ennostar Corporation
- Method for packaging semiconductor device1 Oct 2026US 2026/0305013 A1Oip Technology Pte Ltd.
- Optically powered semiconductor circuit assembly for light-illuminated fluid containers1 Oct 2026US 2026/0305018 A1OWiC Tecnologies, Inc.
- Packaging Method for Photoelectric Element24 Sep 2026US 2026/0293362 A1National Atomic Research Institute
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004
- Optoelectronic element with a non-protruding lens988US 7,067,893 B2Masimo Corporation · 2006
- Method of providing an optoelectronic element with a non-protruding lens861US 7,332,784 B2Masimo Corporation · 2008
- Optical sensor package and method of making same436US 6,130,448 AGentex Corporation · 2000