Image sensor package with stray light directing microstructure component
AssigneePixart Imaging Inc.
InventorsYong-Nong Huang, Cheng-Lin Yang, Hui-Hsuan Chen, Hsin-Hsiang Lo
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Abstract
There is provided an image sensor package including a substrate, a light source, a light sensor, a cover and a microstructure component. The light source and the light sensor are arranged on the substrate. The cover covers upon the substrate and has accommodation space for accommodating the light source and the light sensor. An upper surface of the cover has a recess. The microstructure component is arranged inside the recess to direct stray light toward a direction far from the light sensor.
Claims19
An image sensor package, comprising:
- a substrate;
- a light sensor, arranged on the substrate;
- a light source, arranged on the substrate and located at a side of the light sensor in a first direction;
- a cover, arranged on the substrate and covering the light sensor and the light source, wherein the cover comprises a first opening opposite to the light source, a second opening opposite to the light sensor, and a recess located at an upper surface of the cover and between the first opening and the second opening;
- and
- a microstructure component, arranged inside the recess.
An image sensor package, comprising:
- a substrate;
- a light sensor, arranged on the substrate;
- a light source, arranged on the substrate and located at a side of the light sensor in a first direction;
- a cover, arranged on the substrate and covering the light sensor and the light source, wherein the cover comprises a first opening opposite to the light source, a second opening opposite to the light sensor, and a recess located at an upper surface of the cover and between the first opening and the second opening;
- and
- a microstructure component, arranged inside the recess, wherein a bottom surface of the microstructure component is a zig-zag surface and a top surface of the microstructure component is a plane surface, which is configured to be attached to a protecting film putting on the upper surface of the cover.
An image sensor package, comprising:
- a substrate;
- a light sensor, arranged on the substrate;
- a light source, arranged on the substrate and located at a side of the light sensor in a first direction;
- a cover, arranged on the substrate and covering the light sensor and the light source, wherein the cover comprises a first opening opposite to the light source, a second opening opposite to the light sensor, and a plane upper surface;
- and
- a microstructure component, attached to the plane upper surface, and between the first opening and the second opening.
Dependencies are inferred from the claim text.