Packaging Method for Photoelectric Element

A packaging method for a photoelectric element, comprising:

• step 1:
• adhering a solar cell chip having positive and back electrodes to a front surface of a carrier board using a conductive paste, wherein the carrier board includes an insulating layer having a front surface provided with a first metal layer and a second metal layer and a back surface provided with a third metal layer, the first metal layer being electrically connected to the back electrode of the solar cell chip, and the second metal layer being electrically connected to the third metal layer through a through-hole in the insulating layer, such that the first metal layer and the second metal layer form a first patterned conductive circuit, and the third metal layer forms a second patterned conductive circuit;
• step 2:
• welding at least one gold wire using a wire bonder to electrically connect the solar cell chip to the second metal layer via the at least one gold wire;
• step 3:
• coating optical-grade silicone on the solar cell chip and surroundings thereof to form an insulating protective layer covering the second metal layer, the solar cell chip, and a portion of the first metal layer;
• and
• step 4:
• depositing a photocatalyst effective for catalyzing a hydrogen or oxygen production reaction respectively on a portion of the first metal layer on the front surface of the carrier board that is exposed by the insulating protective layer and on the third metal layer on the back surface of the carrier board, thereby completing a packaging structure of a solar cell configured for direct immersion in an electrolyte.