Method for packaging semiconductor device

A method for packaging a semiconductor device, comprising:

• providing a substrate chip having a front side and an opposing backside;
• forming a plurality of photoelectric conversion modules at spacings on the front side of the substrate chip, wherein the plurality of photoelectric conversion modules are connected to the substrate chip by vias, so that the front side of the substrate chip is exposed between adjacent photoelectric conversion modules;
• forming protective caps on the front side of the substrate chip between adjacent photoelectric conversion modules, each protective cap having inner surfaces and outer surfaces, the inner surfaces together defining a cavity;
• forming an encapsulation layer over the front side of the substrate chip, wherein the encapsulation layer fills gaps between the photoelectric conversion modules, and surfaces of the photoelectric conversion modules are exposed from the encapsulation layer;
• cutting, from surfaces of the protective caps, the protective caps and the substrate chip so that each cavity is separated into two parts each having an open side;
• bonding the backside of the substrate chip to system boards;
• and
• plugging pluggable optical array modules into the cavities from the open sides, thereby integrating the pluggable optical array modules with the substrate chip.