H10F 39/024
Of coatings or optical elements
Official title: {of coatings or optical elements}
H10F39/024 (Of coatings or optical elements) appears on 3,862 US grants and 4,995 published applications in this corpus.
Search patents in H10F- Granted patents
- 3,862
- Published applications
- 4,995
- Assignees
- 650
- Inventors
- 5,250
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 20 | 12 |
| 2002 | 17 | 19 |
| 2003 | 38 | 29 |
| 2004 | 26 | 51 |
| 2005 | 30 | 101 |
| 2006 | 45 | 213 |
| 2007 | 77 | 186 |
| 2008 | 94 | 238 |
| 2009 | 127 | 193 |
| 2010 | 169 | 187 |
| 2011 | 145 | 158 |
| 2012 | 121 | 138 |
| 2013 | 137 | 136 |
| 2014 | 152 | 218 |
| 2015 | 199 | 284 |
| 2016 | 285 | 336 |
| 2017 | 291 | 301 |
| 2018 | 272 | 249 |
| 2019 | 248 | 281 |
| 2020 | 249 | 273 |
| 2021 | 186 | 273 |
| 2022 | 193 | 259 |
| 2023 | 186 | 255 |
| 2024 | 183 | 260 |
| 2025 | 182 | 221 |
| 2026 | 138 | 124 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-substrate image sensor device and method with metalens6 Oct 2026US 12,757,503 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sensing device, and method of manufacturing the same6 Oct 2026US 12,757,508 B2Innolux Corporation
- Three-layered stacked image sensor and method of manufacturing the same6 Oct 2026US 12,757,514 B2Samsung Electronics Co., Ltd.
- Photodiode with deep trench isolation structures29 Sep 2026US 12,751,102 B2Globalfoundries Singapore Pte. Ltd.
- Image sensors having high density subpixels therein with enhanced pixel separation structures29 Sep 2026US 12,751,103 B2Samsung Electronics Co., Ltd.
- Sensor manufacturing method and sensor8 Oct 2026US 2026/0314086 A1The Hong Kong University of Science and Technology
- Image sensor device and method8 Oct 2026US 2026/0314088 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Imaging device8 Oct 2026US 2026/0314094 A1Sony Semiconductor Solutions Corporation
- Image sensing device and method for manufacturing the same8 Oct 2026US 2026/0314095 A1SK hynix Inc.
- Deep trench isolation structure and methods for fabrication thereof8 Oct 2026US 2026/0314102 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Grated landing area to eliminate sticking of micro-mechanical devices322US 5,665,997 ATexas Instruments Incorporated · 1997
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method and apparatus for image sensor packaging244US 9,337,235 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure of semiconductor device with improved reliability229US 6,635,941 B2Canon Kabushiki Kaisha · 2003
- Capturing and processing of images using monolithic camera array with heterogeneous imagers210US 8,902,321 B2Pelican Imaging Corporation · 2014