H10F 39/018
Of hybrid image sensors
Official title: {of hybrid image sensors}
H10F39/018 (Of hybrid image sensors) appears on 1,491 US grants and 1,923 published applications in this corpus.
Search patents in H10F- Granted patents
- 1,491
- Published applications
- 1,923
- Assignees
- 335
- Inventors
- 2,158
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 7 | 3 |
| 2003 | 5 | 10 |
| 2004 | 7 | 12 |
| 2005 | 9 | 11 |
| 2006 | 9 | 24 |
| 2007 | 10 | 18 |
| 2008 | 11 | 16 |
| 2009 | 15 | 30 |
| 2010 | 20 | 49 |
| 2011 | 30 | 27 |
| 2012 | 24 | 36 |
| 2013 | 27 | 49 |
| 2014 | 38 | 74 |
| 2015 | 81 | 106 |
| 2016 | 116 | 130 |
| 2017 | 107 | 137 |
| 2018 | 138 | 147 |
| 2019 | 119 | 154 |
| 2020 | 144 | 160 |
| 2021 | 125 | 134 |
| 2022 | 98 | 139 |
| 2023 | 97 | 128 |
| 2024 | 94 | 136 |
| 2025 | 92 | 123 |
| 2026 | 53 | 70 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Signal shielding for integrated circuits29 Sep 2026US 12,751,104 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Pixel with dual-PD layout22 Sep 2026US 12,745,477 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensor and method of manufacturing image sensor15 Sep 2026US 12,740,175 B2Samsung Electronics Co., Ltd.
- Semiconductor device, electronic device, and method for manufacturing semiconductor device8 Sep 2026US 12,733,285 B2Sony Group Corporation
- Solid-state imaging device, method for manufacturing the same, and electronic apparatus8 Sep 2026US 12,733,287 B2Sony Semiconductor Solutions Corporation
- Semiconductor capacitor for stacked pixel1 Oct 2026US 2026/0304992 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure1 Oct 2026US 2026/0305326 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Stacked devices and methods of fabrication1 Oct 2026US 2026/0305491 A1Adeia Semiconductor Bonding Technologies Inc.
- Monolithic focal plane array circuit and method thereof24 Sep 2026US 2026/0293333 A1Aeluma, Inc.
- Semiconductor device3 Sep 2026US 2026/0262317 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Apparatus for multiple camera devices and method of operating same466US 7,199,348 B2Newport Imaging Corporation · 2007
- Digital camera with integrated infrared (IR) response277US 7,566,855 B22009
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method and apparatus for image sensor packaging244US 9,337,235 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Conductive pad structure for hybrid bonding and methods of forming same243US 9,437,572 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016