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  1. Technology classes
  2. /H · Electricity
  3. /H10 · Semiconductor devices
  4. /H10D · Inorganic electric semiconductor devices
  5. /H10D 80/00 · Assemblies of multiple devices comprising at least one device covered by this
  6. /H10D 80/20 · The at least one device being covered by groups h10d1/00 - h10d48/00
  7. /H10D 80/211 · Resistors, capacitors or inductors covered by h10d1/00
  8. /H10D 80/215
H10D 80/215

Capacitors

Official title: {Capacitors}

H10D80/215 (Capacitors) appears on 3 US grants and 46 published applications in this corpus.

Search patents in H10D

Where it sits

  1. HElectricity
  2. H10Semiconductor devices
  3. H10DInorganic electric semiconductor devices
  4. H10D 80/00Assemblies of multiple devices comprising at least one device covered by this
  5. H10D 80/20The at least one device being covered by groups h10d1/00 - h10d48/00
  6. H10D 80/211Resistors, capacitors or inductors covered by h10d1/00
  7. H10D 80/215Capacitors
Granted patents
3
Published applications
46
Assignees
36
Inventors
123
Latest grant
11 Aug 2026

Filings by year

Granted patentsPublished applications
H10D 80/215: granted patents and published applications per publication year
YearGranted patentsPublished applications
202403
202508
2026335

202420252026

By publication year. 2026 runs to 8 Oct.

Recent patents

  • Display apparatus11 Aug 2026US 12,707,817 B2Samsung Display Co., Ltd.
  • Semiconductor device and electronic device19 May 2026US 12,632,718 B2Semiconductor Energy Laboratory Co.Ltd.
  • Chip packaging structure and preparation method therefor14 Apr 2026US 12,604,730 B2National Center for Advanced Packaging Co., Ltd.
  • Concentric dtc bumps for high density package decap solution8 Oct 2026US 2026/0313924 A1QUALCOMM Incorporated
  • A Multi-Layer Deep-Trench Capacitor8 Oct 2026US 2026/0313925 A1Lotus Microsystems Aps
  • Monolithic microwave integrated circuit1 Oct 2026US 2026/0304907 A1Qorvo US, Inc.
  • Structure and method to provide capacitive junction with contact bars of different depths24 Sep 2026US 2026/0293171 A1Globalfoundries Singapore Pte. Ltd.
  • Semiconductor device24 Sep 2026US 2026/0293272 A1Kabushiki Kaisha Toshiba

Most cited

By later US patents

No patent in this class has been cited by a later US patent yet.

Top assignees

Documents
  • Samsung Electronics Co., Ltd.5
  • Monolithic Power Systems, Inc.4
  • Microchip Technology Incorporated3
  • SESemiconductor Energy Laboratory Co.Ltd.3
  • TSTaiwan Semiconductor Manufacturing Company.Ltd3
  • Fuji Electric Co., Ltd.2
  • Mitsubishi Electric Corporation2
  • NCNational Center for Advanced Packaging Co., Ltd.2
  • Samsung Display Co., Ltd.2
  • SXShanghai Xianfang Semiconductor Co., Ltd.2

Often classified with

  • H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by36
  • H10BElectronic memory devices10
  • G06FComputing and data processing5
  • H02MApparatus for conversion between ac and ac, between ac and dc, or5
  • H05KPrinted circuits4
  • G01NInvestigating or analysing materials by determining their chemical or physical properties3
  • G06GAnalogue computers3
  • G06NAI and machine learning3
  • G11CStatic stores3
  • H03KPulse technique3

Documents that also carry the other class.

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